features * plastic package has underwriters laboratory flammability classification 94v-0 * high temperature metallurgically bonded construction * cavity-free glass passivated junction * capable of meeting environmental standards of mil-s-19500 * fast switching for high efficiency * typical ir less than 1.0 a * high temperature soldering guaranteed: 260 c/10 seconds mechanical data case : jedec do-214aa / smb, molded plastic over glass die terminals : plated axial leads, solderable per mil-std-750, method 2026 polarity : color band denotes cathode end we declare that the material of product compliance mounting position : any with rohs requirements weight : 0.098 g handling precautin :none 1.maximum & thermal characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol ffm 201 ffm 202 ffm 203 ffm 204 ffm 205 ffm 206 ffm 207 ffm 207p unit device marking code ffm 201 ffm 202 ffm 203 ffm 204 ffm 205 ffm 206 ffm 207 ffm 207p maximum repetitive peak reverse voltage v rrm 5010020040060080010001000v maximum rsm voltage v rsm 3570140280420560700700v maximum dc blocking voltage v dc 5010020040060080010001000v maximum average forward rectified current 0.375" (9.5mm) lead length at t a = 75 c if(av) a peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm a typical thermal resistance (note 2) r ja c/w operating junction and storage temperature range tj, tstg c electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol ffm 201 ffm 202 ffm 203 ffm 204 ffm 205 ffm 206 ffm 207 ffm 207p unit maximum instantaneous forward voltage at 2.0a v f v maximum dc reverse current ta = 25 c at rated dc blocking voltage ta = 125 c ir a typical reverse recovery time (note 1) trr250ns typical junction capacitance at 4.0v, 1mhz cjpf notes: 1. if = 0.5a, ir = 1.0a, irr = 0.25a 2. thermal resistance from junction to ambient at 0.375 (9.5mm) lead length, p.c.b. mounted 1.3 5.0 100 8.0 ffm201 thru FFM207p 150500 surface mount glass passivated super fast rectifiers reverse voltage 50 to 1000v forward current 2.0a 2.0 70 55 C 50 to +150
2.ratings and characteristic curves ( ta = 25 c unless otherwise noted ) ffm201 thru FFM207p fig. 1 C forward current derating curve fig. 2 C maximum non-repetitive peak forward surge current fig 4. C typical reverse characteristics fig 3. C typical instantaneous forward characteristics fig 5. C typical transient thermal impedance fig 6. C typical junction capacitance a v e r a g e f o r w a r d r e c t i f i e d c u r r e n t ( a ) a v e r a g e f o r w a r d r e c t i f i e d c u r r e n t ( a ) i n s t a n t a n e o u s f o r w a r d c u r r e n t ( a ) i n s t a n t a n e o u s r e v e r s e c u r r e n t ( a ) j u n c t i o n c a p a c i t a n c e ( p f ) 0 25 50 75 100 125 150 175 1 10 100 0.6 0.8 1.0 1.2 1.4 1.60 20 40 60 80 100 0.1 1 10 20 10 1.0 100 10 1.0 0.1 0.01 10 1.0 0.1 0.01 100 2.0 1.0 0 100 80 60 40 20 0 60 hz resistive or inductive load 0.375" (9.5mm) lead length tj = tj max 8.3ms single half sine-wave (jedec method) tj = 25 c pulse width = 300 s 1% duty cycle tj = 25 c f = 1.0 mhz vsig = 50mvp-p ambient temperature, c number of cycles at 60hz instantaneous forward voltage (v)percent of rated peak reverse voltage (%) reverse voltage (v) tj=125 tj=25 C C c / w ) 10 1.0 0.1 100 0.01 0.1 1.0 10 100 t,pulse duration,sec
3. dimension: ffm201 thru FFM207p
titile: 1.1 ? reel a. ? reel spec mm abcw 177.0 2.054.0 0.513.0 0.513.2 0.2 330.0 2.075.0 0.513.0 0.513.2 0.2 330.0 2.075.0 0.513.0 0.513.5 0.5 330.0 2.075.0 0.513.0 0.517.0 0.5 b. 13" ? inner box mm abc ? 335 5.0335 2.040 1.0 ?? ? ?? quantity ? 10k 6k 6k smb13" smc13" ? 2k 5k 3k 3k sma13" sma 7" sma13" smc13" smb13" ?? wi-258 ? smd ??Z 3 0 ? 2 ? smd ??e????? packaging specification of smd general packaging materials spec. and quantity
titile: c. 7" ? box mm abc ? 188 2.0188 2.0138 2.0 ?? ? ?? quantity 7" d. reel carton mm abc ? 350 2.0340 2.0350 2.0 ?? ? ?? ? 80k 80k 48k 36k 1.2 tape spec a. cover tape mm a sma smb smc13.30 0.10 smb13" smc13" 9.30 0.10 0.068 0.005 b packaging specification of smd 3 ? 16k ? sma 7" sma13" ?? wi-258 ? smd ??Z ?? wi-258
titile: b. sma smb smc w12 0.3 12 0.3 16 0.3 p14 0.1 8 0.1 8 0.1 e1.75 0.1 1.75 0.1 1.75 0.1 f5.5 .05 5.5 0.05 7.5 .05 d01.55 0.05 1.55 0.05 1.55 0.05 d11.5 0.1 1.55 0.05 1.55 0.05 p04 0.1 4 0.1 4 0.1 p22 0.05 2 0.05 2 0.05 10p040 0.2 40 0.2 40 0.2 a02.79 0.1 3.8 0.1 6.05 0.1 b05.33 0.1 5.4 0.1 8.31 0.1 k02.36 0.1 2.45 0.1 2.54 0.1 t0.25 0.05 0.25 0.05 0.25 0.05 2 smd ??e?Z general spec of smd 5.2.1 ?? domestic a. 7" reel ??? all the label on cathode side a : lrc ? ; b : rohs ? c : ? hf label b. 13" ??? all the label on cathode side ? hf only a : lrc ? ; b : rohs ? c : ? ? hf only 4 ? ? smd ??Z 3 0 ? ?? wi-258 packaging specification of smd a a a k o sec.:a-a' ao p2 p1 a do w e f a' b po b' b o sec.:b-b' t d1 c c c c
titile: c. ? ? label spec lrc ? label rohs ? ? hf label ??? all the label on cathode side overseas 13" ? inner box a : lrc ? ; b : rohs ? c : ? hf label ? hf only 5 ? 7" ? inner box packaging specification of smd ?? wi-258 ? smd ??Z 3 0 ? 2.2 ? a a ****** ****** ****** ****** lrc ? type ? quantity ? date ? lot green c c c
titile: lrc ? label rohs ? ? hf label ? note: 1. 13" ?? ? , ? ? ;13"reel inner box must be packed by shrink film 2. ?? ? , ? ? ; every tape after packing must be fixed by white adhesive tape 3.1 ? l testing report of the oqc ?? ? l every lot must with test report 3.2 ? ? ? ?? ? ? ? ?? ? ? the same coding is only one ending for each batch box materials for the mantissa to be good filled with cushioning material. mark:****** q'ty:****** ?? wi-258 ? smd ??Z 3 0 ? 6 ? date:****** type:****** packaging specification of smd lrc ? ? ? ? green
4. update record 1 2 ??Z? 2011-7-18 ?? 2011-3-11 ffm101 thru ffm107p ???
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